プレスリリース：2008年12月22日
新製品情報 Prewell Corporation
High Linearity InGaP HBT Amplifier PH830-S8
Meduim Power PH830-S8_v12.pdf
Prewell Corporation - High Linearity InGaP HBT Amplifier PH830-S8
Features
- 800MHz - 2300MHz
- 17.0 dB Gain at 900MHz
- +33 dBm P1dB
- +48 dBm Output IP3
- Dual Bias Supply
- Lead-free / Green / RoHS compliant SOIC-8 Package
Applications
- Mobile Infrastructure
- Cellular, GSM
- PCS, WCDMA, WiBro, WiMax
- W-LAN / ISM
- RFID / Fixed Wireless
Functional Diagram
Description
The PH830-S8 is a high performance InGaP HBT MMIC Amplifier and high linearity driver amplifier in a high quality SOIC-8 package. The device features excellent Input and output return loss, highly linear performance. The device can be easily matched to obtain optimum power and linearity. The product is targeted for use as driver amplifier for wireless infrastructure applications. The PH830-S8 operates from a single +5.5 voltage supply and have an internal active bias. All devices are 100% RF and DC tested
Specifications
Test Conditions : T=25°C, Supply Voltage=+5.5V, 50ohm System, OIP3 measured with two tones at an output power of +17dBm/tone separated by 1MHz.
900 MHz Application Circuit
Test Board Information : FR4 PCB (Dielectric Constant = 4.6, thick = 0.8mm(32mil))
RF Microstrip Line Width = 1mm(39mil), Tuning Via Diameter ('R1','R2','R3','L1','L2', 'L3',etc.) and Distance = 0.5mm(20mil)
All Passive Component Size is 1608(0603) and L1 is coil inductor
| Gain vs. Frequency | Input Return Loss | Output Return Loss |
 |
 |
 |
| P1dB vs. Frequency | Output IP3 vs. Frequency +17dBm/tone, +25oC |
OIP3 vs. Temperature Freq=900MHz, +17dBm/tone |
 |
 |
 |
| Noise Figure vs. Frequency | ||
 |
1775 MHz Application Circuit
Test Board Information : FR4 PCB (Dielectric Constant = 4.6, thick = 0.8mm(32mil))
RF Microstrip Line Width = 1mm(39mil), Tuning Via Diameter ('R1','R2','R3', 'L1','L2',' L3',etc.) and Distance = 0.5mm(20mil)
All Passive Component Size is 1608(0603) and L1 is coil inductor
RF Microstrip Line Width = 1mm(39mil), Tuning Via Diameter ('R1','R2','R3', 'L1','L2',' L3',etc.) and Distance = 0.5mm(20mil)
All Passive Component Size is 1608(0603) and L1 is coil inductor
| Gain vs. Frequency | Input Return Loss | Output Return Loss |
 |
 |
 |
| P1dB vs. Frequency | Output IP3 vs. Frequency +17dBm/tone, +25oC |
OIP3 vs. Temperature Freq=1775MHz, +17dBm/tone |
 |
 |
 |
| Noise Figure vs. Frequency | ||
 |
1950 MHz Application Circuit
RF Microstrip Line Width = 1mm(39mil), Tuning Via Diameter ('R1','R2','R3', 'L1','L2','L3',etc.) and Distance = 0.5mm(20mil)
All Passive Component Size is 1608(0603) and L1 is coil inductor
| Gain vs. Frequency | Input Return Loss | Output Return Loss |
 |
 |
 |
| P1dB vs. Frequency | Output IP3 vs. Frequency +17dBm/tone, +25oC |
OIP3 vs. Temperature Freq=1950MHz, +17dBm/tone |
 |
 |
 |
| Noise Figure vs. Frequency | ||
 |
2140 MHz Application Circuit
Test Board Information : FR4 PCB (Dielectric Constant = 4.6, thick = 0.8mm(32mil))
RF Microstrip Line Width = 1mm(39mil), Tuning Via Diameter ('R1','R2','R3','L1','L2','L3',etc.) and Distance = 0.5mm(20mil)
All Passive Component Size is 1608(0603) and L1 is coil inductor
| Gain vs. Frequency | Input Return Loss | Output Return Loss |
 |
 |
 |
| P1dB vs. Frequency | Output IP3 vs. Frequency +17dBm/tone, +25oC |
OIP3 vs. Temperature Freq=2140MHz, +17dBm/tone |
 |
 |
 |
| Noise Figure vs. Frequency | ||
 |
| 4FA W-CDMA ACLR vs. Channel Power 3GPP W-CDMA 4FA, Test Model5 + w/8HSPDSCH |
6FA W-CDMA ACLR vs. Channel Power 3GPP W-CDMA 6FA, Test Model5 + w/8HSPDSCH |
 |
 |
| 4FA W-CDMA ACLR @1950MHz Center 1950MHz #RBW 30kHz #VBW 1kHz Span 59.68MHZ |
6FA W-CDMA ACLR @1950MHz Center 1950MHz #RBW 30kHz #VBW 1kHz Span 71.78MHZ |
 |
 |
| 4FA W-CDMA ACLR vs. Channel Power 3GPP W-CDMA 4FA, Test Model5 + w/8HSPDSCH |
6FA W-CDMA ACLR vs. Channel Power 3GPP W-CDMA 6FA, Test Model5 + w/8HSPDSCH |
 |
 |
| 4FA W-CDMA ACLR @2140MHz Center 2140MHz #RBW 30kHz #VBW 1kHz Span 59.68MHZ |
6FA W-CDMA ACLR @2140MHz Center 2140MHz #RBW 30kHz #VBW 1kHz Span 71.78MHZ |
 |
 |
Absolute Maximum Ratings
Lead-free /RoHS Compliant / Green SOIC-8 Package Outline
Land Pattern
ESD / MSL Ratings
- 1. ESD sensitive device.Observe Handling Precautions.
- 2. ESD Rating : Class 1C(Passes at 1000V min.)Human Body Model (HBM), JESD22-A114
- 3. ESD Rating : Class IV (Passes at 1000V min.)Charged Device Model (CDM), JESD22-C101
- 4. MSL (Moisture Sensitive Level) Rating : Level 3 at +260°C Convection reflow, J-STD-020
Evaluation Board Layout (4x4)
Mounting Instructions
- 1. Use a large ground pad area with many plated through-holes as shown.
- 2. We recommend 1 oz copper minimum.
- 3. Measurement for our data sheet was made on 0.8mm thick FR-4 Board.
- 4. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
- 5. RF trace width depends on the board material and construction.
- 6. Add mounting screws near the part to fasten the board to a heatsink.
プリウェル社詳細は http://www.netwell.co.jp/wireless/maker/prewell.html
お問い合わせ
株式会社ネットウエル 無線通信営業部
電話：03-5368-3453
オンラインでのお問い合わせはお問い合わせフォームから
