トップページ › 無線通信営業部ホーム › ニュースリリース一覧 › 新製品情報　Prewell プリウェルGaAs p-HEMT LNA (Low Noise Amplifier) PLN25

無線通信営業部

ニュースリリース

プレスリリース：2009年3月 2日

新製品情報　Prewell プリウェル
GaAs p-HEMT LNA (Low Noise Amplifier) PLN25

LNA (5.5X5.5) PLN25.pdf

Prewell Corporation　-　GaAs p-HEMT LNA PLN25
Features
  • 2300 -2700MHz
  • 12.2 dB Gain at 2300MHz
  • +30.0 dBmOutput IP3
  • 0.75 dB Noise Figure at 2300MHz
  • 5.5x5.5 size / No matching circuit needed
  • Low power consumption (3V/45mA)
  • Surface mount type

Applications
  • LNA for PCS
  • Repeater
  • Base Station
  • Mobile Infrastructure
Applications

Functional Diagram
Functional Diagram

Functional Diagram

Description

The PLN25 is a high performance GaAs p-HEMT LNA(Low Noise Amplifier).
The amplifier features high linear performance,low noise figure,low power consumption and high reliability.
The PLN25 operates from a single voltage supply and no matching circuit needed.
The device is a superior performance p-HEMT amplifier that offers high dynamic range in a low cost miniature surface mount type with metal cover.
These PLN series provide the most suitable solutions for LNA in communication systems.


Specifications
Specifications

Test Conditions : T=25°C, Supply Voltage=+3.0V, 50ohm System, OIP3 measured with two tones at an output power of 0dBm/tone separated by 1MHz.
Application Circuit
Application Circuit

  1. Bypass Capacitors(10nF & 1uF) should be added for bypassing the AC noise
  2. No matching circuit needed
Typical RF Performance
Gain vs. Frequency
NF vs. Frequency
Gain vs. Frequency
NF vs. Frequency
Input Return Loss
Output Return Loss
Input Return Loss
Output Return Loss
Output IP3 vs. Frequency
P1dB vs. Frequency
Output IP3 vs. Frequency
P1dB vs. Frequency

Absolute Maximum Ratings
Absolute Maximum Ratings quency
Operation of this device above any of these parameters may cause permanent damage.

Outline Drawing
Outline Drawing
Soldering Time Profile
  1. Maximum temperature: +260°C or below.
  2. Time at maximum temperature: 10s or less
  3. Time of temperature higher than +220°C : 60s or less
  4. Preheating time at +120°C to+180°C: 120±30s
  5. Maximum number of reflow process : 3times
  6. Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less

Soldering Time Profile

Evaluation Board Layout (2.3x2.3)
Evaluation Board Layout (2.3x2.3)

Mounting Instructions
  1. Use a large ground pad area with many plated through-holes as shown.
  2. We recommend 1 oz copper minimum.
  3. Measurement for our datasheet was made on 0.8mm thick FR-4 Board.
  4. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
  5. RF trace width depends on the board material and construction.
  6. All area of GND PAD should be connected to GND


プリウェル社詳細は http://www.netwell.co.jp/wireless/maker/prewell.html

お問い合わせ

株式会社ネットウエル　無線通信営業部
電話：03-5368-3453
オンラインでのお問い合わせはお問い合わせフォームから

上へ戻る